Foundry Service
Fab(Wafer)
Foundry service
- 1
- InP HEMT
- 2
- DFB Laser Diode (1300nm ~ 1600nm)
- 3
- Micro LED (10~100um) for Display
- 4
- InGaP / GaAs : Solar cells 4. GaAs HEMT
Unit process service
capability of various processes such as photolithography, deposition, wet/dry etching, metallization and wafer level testing for chip processes
based on III-V compound semiconductor with GaAs and InP substrates.
- Fine pattering
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- Stepper
- Aligner
- Dielectric film deposition (SiO2, Si3N4)
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- PECVD (200~400℃)
- Dry Etching (GaAs, InP, Dielectric film)
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- ICP
- RIE
- Thermal Annealing
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- RTP (~500℃)
- Front/Backside Metallizaion (Ti/Pt/Au/Ni/Cr/AuGe/Au)
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- E-beam
- Wafer level test
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- L-I-V
