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Foundry Service

Fab(Wafer)

Foundry service

1
InP HEMT
2
DFB Laser Diode (1300nm ~ 1600nm)
3
Micro LED (10~100um) for Display
4
InGaP / GaAs : Solar cells 4. GaAs HEMT

Unit process service

capability of various processes such as photolithography, deposition, wet/dry etching, metallization and wafer level testing for chip processes
based on III-V compound semiconductor with GaAs and InP substrates.

Fine pattering
  • Stepper
  • Aligner
Dielectric film deposition (SiO2, Si3N4)
  • PECVD (200~400℃)
Dry Etching (GaAs, InP, Dielectric film)
  • ICP
  • RIE
Thermal Annealing
  • RTP (~500℃)
Front/Backside Metallizaion (Ti/Pt/Au/Ni/Cr/AuGe/Au)
  • E-beam
Wafer level test
  • L-I-V
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